- Manufacturer：
-
- CUI Devices (22)
- Wakefield Thermal (57)
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
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79 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 8.5... |
3,672 |
1,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 40 ... |
1,280 |
1,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 17 ... |
3,872 |
1,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 20 ... |
1,872 |
1,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 35 ... |
1,280 |
1,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | ANCHOR HEATSINK ... |
1 |
321
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | ANCHOR HEATSINK ... |
1 |
986
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | FANSINK 5VDC 50X50X... |
1 |
6
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | FANSINK 12VDC 55X55... |
1 |
49
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | FANSINK 12VDC 55X55... |
1 |
41
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | FANSINK 12VDC 55X55... |
1 |
15
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 30.... |
1 |
543
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 12 ... |
1 |
54
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 21 ... |
1 |
1,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 40 ... |
1 |
1,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 35 ... |
1 |
1,178
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 14 ... |
1 |
2,354
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 27 ... |
1 |
1,039
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 18 ... |
1 |
1,582
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 23 ... |
1 |
1,588
In-stock
|
Get Quote |
