- Manufacturer:
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- Part Status:
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- Package Cooled:
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- Attachment Method:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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7 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
![]() |
Wakefield Thermal | HEATSINK BXB50,75,1... |
320 |
1,000
In-stock
|
Get Quote | ||
![]() |
Apex Microtechnology | HEATSINK 8P TO-3 4.... |
1 |
1,000
In-stock
|
Get Quote | ||
![]() |
Wakefield Thermal | HEATSINK DC/DC HA... |
320 |
1,000
In-stock
|
Get Quote | ||
![]() |
Wakefield Thermal | HEATSINK DC/DC HA... |
1 |
1,000
In-stock
|
Get Quote | ||
![]() |
Wakefield Thermal | HEATSINK DC/DC HA... |
320 |
1,000
In-stock
|
Get Quote | ||
![]() |
Wakefield Thermal | HEATSINK DC/DC HA... |
320 |
1,000
In-stock
|
Get Quote | ||
![]() |
Wakefield Thermal | HEATSINK DC/DC HA... |
1 |
2,493
In-stock
|
Get Quote |