- Manufacturer：
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- CUI Devices (1)
- Material：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Material Finish：
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13 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 20 ... |
1,872 |
1,000
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | SUPERGRIP HEATSI... |
1 |
66
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK 19X12MM F... |
1 |
1,000
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 25MM X 25... |
1 |
90
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK 19X12MM S... |
1 |
175
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK 19X12MM D... |
1 |
111
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK PASSIV... |
1 |
94
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 25MM X 25... |
1 |
32
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 25MM X 25... |
1 |
52
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 25MM X 25... |
1 |
97
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 17MM X 17... |
1 |
24
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 25X25X7.5M... |
10 |
1,000
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 17X17X24.5M... |
10 |
1,000
In-stock
|
Get Quote |
