- Manufacturer:
-
- Aavid (4)
- Comair Rotron (3)
- CUI Devices (2)
- Ohmite (14)
- Part Status:
-
- Material:
-
- Attachment Method:
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Forced Air Flow:
-
- Thermal Resistance @ Natural:
-
- Material Finish:
-
33 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
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Ohmite | HEATSINK D2PAK TO... |
200 |
1,000
In-stock
|
Get Quote | ||
![]() |
Ohmite | HEATSINK D2PAK TO... |
200 |
1,000
In-stock
|
Get Quote | ||
![]() |
Ohmite | TO-263 SMD HEAT SIN... |
200 |
1,000
In-stock
|
Get Quote | ||
![]() |
CUI Devices | HEAT SINK TO-263 CO... |
9,000 |
1,000
In-stock
|
Get Quote | ||
![]() |
Ohmite | HEATSINK FOR TO-2... |
1 |
1,000
In-stock
|
Get Quote | ||
![]() |
Ohmite | HEATSINK FOR TO-2... |
1 |
1,000
In-stock
|
Get Quote | ||
![]() |
Ohmite | TO-263 SMD HEAT SIN... |
1 |
1,000
In-stock
|
Get Quote | ||
![]() |
Ohmite | TO-263 SMD HEAT SIN... |
1 |
1,000
In-stock
|
Get Quote | ||
![]() |
Wakefield Thermal | HEATSINK SMT PKG |
1 |
1,000
In-stock
|
Get Quote | ||
![]() |
Ohmite | HEATSINK D2PAK TO... |
1 |
1,000
In-stock
|
Get Quote | ||
![]() |
Ohmite | HEATSINK D2PAK TO... |
1 |
1,000
In-stock
|
Get Quote | ||
![]() |
Comair Rotron | HEATSINK STAMP 19... |
1 |
1,000
In-stock
|
Get Quote | ||
![]() |
Comair Rotron | HEATSINK STAMP 25... |
1 |
1,000
In-stock
|
Get Quote | ||
![]() |
Comair Rotron | HEATSINK STAMP 26... |
1 |
1,000
In-stock
|
Get Quote | ||
![]() |
ASSMANN WSW Components | HEATSINK TO-263 12.7... |
1 |
21,650
In-stock
|
Get Quote | ||
![]() |
Aavid | HEATSINK D2PAK .4"... |
1 |
31,458
In-stock
|
Get Quote | ||
![]() |
Advanced Thermal Solutions, Inc. | HEATSINK TO-263 CO... |
1 |
12,616
In-stock
|
Get Quote | ||
![]() |
Advanced Thermal Solutions, Inc. | HEATSINK TO-263 CO... |
1 |
5,492
In-stock
|
Get Quote | ||
![]() |
Aavid | TOP MOUNT HEATSI... |
1 |
11,061
In-stock
|
Get Quote | ||
![]() |
Ohmite | HEATSINK FOR TO-2... |
1 |
1,648
In-stock
|
Get Quote |