- Manufacturer:
-
- CUI Devices (10)
- T-Global Technology (10)
- Material:
-
- Package Cooled:
-
- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Material Finish:
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28 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
CUI Devices | HEATSINK TO-220 4.1W... |
8,000 |
1,000
In-stock
|
Get Quote | |||
CUI Devices | HEATSINK TO-220 3.6W... |
4,000 |
1,000
In-stock
|
Get Quote | |||
CUI Devices | HEATSINK TO-220 3.6W... |
10,000 |
1,000
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK TO-252 CO... |
10,500 |
1,000
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK TO-263 CO... |
9,000 |
1,000
In-stock
|
Get Quote | |||
T-Global Technology | ALUMINIUM HEAT S... |
3,000 |
1,000
In-stock
|
Get Quote | |||
Advanced Thermal Solutions, Inc. | HEATSINK TO-252 D-P... |
1 |
2,641
In-stock
|
Get Quote | |||
Advanced Thermal Solutions, Inc. | HEATSINK TO-263 CO... |
1 |
12,616
In-stock
|
Get Quote | |||
Advanced Thermal Solutions, Inc. | HEATSINK TO-263 CO... |
1 |
5,492
In-stock
|
Get Quote | |||
T-Global Technology | ALUMINIUM HEAT S... |
1 |
89
In-stock
|
Get Quote | |||
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 BL... |
1 |
352
In-stock
|
Get Quote | |||
NTE Electronics, Inc. | HEATSINK FOR PLA... |
1 |
79
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK TO-263 CO... |
150 |
600
In-stock
|
Get Quote | |||
T-Global Technology | ALUMINIUM HEAT S... |
1 |
89
In-stock
|
Get Quote | |||
T-Global Technology | ALUMINIUM HEAT S... |
1 |
16
In-stock
|
Get Quote | |||
NTE Electronics, Inc. | HEATSINK FOR TO22... |
1 |
317
In-stock
|
Get Quote | |||
T-Global Technology | ALUMINIUM HEAT S... |
1 |
105
In-stock
|
Get Quote | |||
T-Global Technology | ALUMINIUM HEAT S... |
1 |
171
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK EXTRUSI... |
1 |
29
In-stock
|
Get Quote | |||
T-Global Technology | ALUMINIUM HEAT S... |
1 |
49
In-stock
|
Get Quote |