- Package Cooled:
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- Attachment Method:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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- Material Finish:
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Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
Advanced Thermal Solutions, Inc. | MAXIGRIP FANSINK... |
100 |
1,000
In-stock
|
Get Quote | |||
Advanced Thermal Solutions, Inc. | MAXIGRIP FANSINK... |
1 |
10
In-stock
|
Get Quote | |||
Aavid | BOARD LEVEL HEAT... |
1,000 |
1,000
In-stock
|
Get Quote | |||
Wakefield Thermal | ALUMINUM HEATSIN... |
1 |
1,000
In-stock
|
Get Quote | |||
Ohmite | HEATSINK TO-218,TO... |
1 |
4,443
In-stock
|
Get Quote | |||
Advanced Thermal Solutions, Inc. | MAXIGRIP FANSINK... |
1 |
1,000
In-stock
|
Get Quote | |||
Advanced Thermal Solutions, Inc. | MAXIGRIP FANSINK... |
1 |
43
In-stock
|
Get Quote | |||
Aavid | 63135 EXTRUSION 1.75X... |
1 |
2
In-stock
|
Get Quote | |||
Aavid | 62200 EXTRUSION 0.85X... |
1 |
11
In-stock
|
Get Quote |