- Manufacturer:
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- CUI Devices (1)
- Material:
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- Shape:
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- Attachment Method:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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- Material Finish:
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20 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
Advanced Thermal Solutions, Inc. | SUPERGRIP HEATSI... |
1 |
6
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK TO-220 W/P... |
1,200 |
1,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK TO-220 W/P... |
1,200 |
1,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK TO-220 W/P... |
1,200 |
1,000
In-stock
|
Get Quote | |||
TE Connectivity AMP Connectors | 7 FINS, 2.00 OD HS W/... |
1 |
1,000
In-stock
|
Get Quote | |||
TE Connectivity AMP Connectors | 7 FINS, 2.000 OD HS W... |
1 |
1,000
In-stock
|
Get Quote | |||
TE Connectivity AMP Connectors | 7 FINS, 2.000 OD HS W... |
1 |
1,000
In-stock
|
Get Quote | |||
Advanced Thermal Solutions, Inc. | 1/4 BRICK HEATSINK... |
1 |
1,063
In-stock
|
Get Quote | |||
Advanced Thermal Solutions, Inc. | HEAT SINK 27MM X 27... |
1 |
344
In-stock
|
Get Quote | |||
Advanced Thermal Solutions, Inc. | HEAT SINK 30MM X 30... |
1 |
102
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK 23X23MM F... |
1 |
248
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, STAMPI... |
1 |
1,405
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK 23X23MM D... |
1 |
1,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK 23X23MM S... |
1 |
68
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK 27X18MM S... |
1 |
86
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK 27X18MM F... |
1 |
76
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK 27X18MM D... |
1 |
28
In-stock
|
Get Quote | |||
Advanced Thermal Solutions, Inc. | HEAT SINK 27MM X 27... |
1 |
9
In-stock
|
Get Quote | |||
Advanced Thermal Solutions, Inc. | HEATSINK 30X30X24.5M... |
10 |
1,000
In-stock
|
Get Quote | |||
Advanced Thermal Solutions, Inc. | HEATSINK 27X27X17.5M... |
10 |
1,000
In-stock
|
Get Quote |