Manufacturer:
Material:
Package Cooled:
Attachment Method:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Natural:
Image Part Manufacturer Description MOQ Stock Action
DV-T263-301E-TR Ohmite
HEATSINK D2PAK TO...
200
RFQ
1,000
In-stock
Get Quote
7129DG Aavid
BOARD LEVEL HEAT...
2,000
RFQ
1,000
In-stock
Get Quote
DA-T263-301E-TR Ohmite
HEATSINK D2PAK TO...
200
RFQ
1,000
In-stock
Get Quote
DA-T263-301E Ohmite
HEATSINK D2PAK TO...
1
RFQ
1,000
In-stock
Get Quote
DV-T263-301E Ohmite
HEATSINK D2PAK TO...
1
RFQ
1,000
In-stock
Get Quote
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