- Manufacturer:
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- CUI Devices (1)
- Material:
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- Package Cooled:
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- Attachment Method:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
![]() |
CUI Devices | HEAT SINK, EXTRUS... |
1,800 |
1,000
In-stock
|
Get Quote | ||
![]() |
Wakefield Thermal | HEAT SINK ELLIP F... |
180 |
1,000
In-stock
|
Get Quote |