- Manufacturer:
-
- CUI Devices (1)
- WEC (1)
- Part Status:
-
- Package Cooled:
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- Attachment Method:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
CUI Devices | HEATSINK TO-220 4.6W... |
3,000 |
1,000
In-stock
|
Get Quote | |||
TE Connectivity AMP Connectors | 35MM HS ASSY ULTEM... |
1 |
1,000
In-stock
|
Get Quote | |||
WEC | 35MM HS ASSY PPA C... |
2 |
683
In-stock
|
Get Quote | |||
TE Connectivity AMP Connectors | 37.5MM HS ASSY ULTE... |
1 |
1,000
In-stock
|
Get Quote |