- Part Status:
-
- Material:
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- Package Cooled:
-
- Attachment Method:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
-
- Material Finish:
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3 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
Wakefield Thermal | HEATSINK TO-220 W/P... |
1 |
1,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK TO-220 W/P... |
1 |
1,491
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK CER TO-2... |
1 |
53
In-stock
|
Get Quote |