- Manufacturer:
-
- CUI Devices (1)
- Part Status:
-
- Type:
-
- Package Cooled:
-
- Attachment Method:
-
- Thermal Resistance @ Natural:
-
- Material Finish:
-
10 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
Wakefield Thermal | HEATSINK 21X21MM S... |
100 |
1,000
In-stock
|
Get Quote | |||
CUI Devices | HEATSINK HALF BR... |
1 |
1,000
In-stock
|
Get Quote | |||
Advanced Thermal Solutions, Inc. | HEAT SINK 40MM X 40... |
1 |
2,582
In-stock
|
Get Quote | |||
Advanced Thermal Solutions, Inc. | HEAT SINK 32.5 X 32.5... |
1 |
159
In-stock
|
Get Quote | |||
Advanced Thermal Solutions, Inc. | SUPERGRIP HEATSI... |
1 |
70
In-stock
|
Get Quote | |||
Advanced Thermal Solutions, Inc. | HEAT SINK 40MM X 40... |
1 |
32
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK 21X21MM D... |
1 |
1,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEATSINK 21X21MM F... |
1 |
97
In-stock
|
Get Quote | |||
Advanced Thermal Solutions, Inc. | HEATSINK 40X40X14.5M... |
10 |
1,000
In-stock
|
Get Quote | |||
Advanced Thermal Solutions, Inc. | HEATSINK 32.5X32.5X1... |
10 |
1,000
In-stock
|
Get Quote |