- Manufacturer:
-
- CTS Corporation (1)
- CUI Devices (1)
- Material:
-
- Package Cooled:
-
- Attachment Method:
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Natural:
-
- Material Finish:
-
11 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
CTS Corporation | HEAT SINK FORGED... |
300 |
1,000
In-stock
|
Get Quote | |||
Advanced Thermal Solutions, Inc. | HEAT SINK 31MM X 31... |
1 |
664
In-stock
|
Get Quote | |||
Advanced Thermal Solutions, Inc. | HEAT SINK 31MM X 31... |
1 |
463
In-stock
|
Get Quote | |||
Advanced Thermal Solutions, Inc. | SUPERGRIP HEATSI... |
1 |
758
In-stock
|
Get Quote | |||
Advanced Thermal Solutions, Inc. | HEAT SINK 30MM X 30... |
1 |
498
In-stock
|
Get Quote | |||
Advanced Thermal Solutions, Inc. | SUPERGRIP HEATSI... |
1 |
98
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, STAMPI... |
1 |
2,336
In-stock
|
Get Quote | |||
Advanced Thermal Solutions, Inc. | HEAT SINK 30MM X 30... |
1 |
95
In-stock
|
Get Quote | |||
Advanced Thermal Solutions, Inc. | HEATSINK 30X30X14.5M... |
10 |
1,000
In-stock
|
Get Quote | |||
Advanced Thermal Solutions, Inc. | HEATSINK 31X31X7.5M... |
10 |
1,000
In-stock
|
Get Quote | |||
Advanced Thermal Solutions, Inc. | HEAT SINK 31MM X 31... |
10 |
1,000
In-stock
|
Get Quote |