- Manufacturer：
-
- Aavid (2)
- Comair Rotron (1)
- CUI Devices (1)
- Part Status：
-
- Material：
-
- Package Cooled：
-
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Material Finish：
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11 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Apex Microtechnology | HEATSINK TO3 |
1 |
1,000
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
1,500 |
1,000
In-stock
|
Get Quote | ||
|
|
Comair Rotron | HEATSINK STAMP 9.... |
1 |
1,000
In-stock
|
Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK TO-220 19X... |
1 |
34,584
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 ST... |
1 |
868
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 30MM X 30... |
1 |
271
In-stock
|
Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK TO-220 15X... |
1 |
43,548
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
1 |
8,900
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
1,970
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 CO... |
1 |
60
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 30X30X9.5M... |
10 |
1,000
In-stock
|
Get Quote |
