- Manufacturer：
-
- CUI Devices (2)
- Material：
-
- Package Cooled：
-
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
3 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEATSINK TO-220 4.1W... |
1 |
338
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 4.1W... |
1 |
382
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TRIPLE ... |
1 |
1,392
In-stock
|
Get Quote |
