- Manufacturer：
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- Ohmite (1)
- Material：
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- Package Cooled：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Material Finish：
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4 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
NTE Electronics, Inc. | HEATSINK FOR PLA... |
1 |
79
In-stock
|
Get Quote | ||
|
|
Ohmite | HEATSINK AND CLI... |
1 |
727
In-stock
|
Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
1 |
1,182
In-stock
|
Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
1 |
496
In-stock
|
Get Quote |
