- Manufacturer：
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- CUI Devices (1)
- Material：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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7 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEATSINK 19X15MM S... |
1 |
94
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK 19X15MM F... |
1 |
1,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK 19X15MM D... |
1 |
1,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 23 ... |
1 |
1,588
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK 23X12MM F... |
1 |
58
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK 23X12MM S... |
1 |
77
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK 23X12MM D... |
1 |
1,000
In-stock
|
Get Quote |
