- Manufacturer:
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- Package Cooled:
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- Attachment Method:
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- Thermal Resistance @ Forced Air Flow:
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- Material Finish:
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3 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
![]() |
Advanced Thermal Solutions, Inc. | PCIE EXTRUSION P... |
1 |
5
In-stock
|
Get Quote | ||
![]() |
ASSMANN WSW Components | HEATSINK ALUM AN... |
1 |
1,000
In-stock
|
Get Quote | ||
![]() |
Advanced Thermal Solutions, Inc. | PCIE EXTRUSION P... |
1 |
1,000
In-stock
|
Get Quote |