- Manufacturer:
-
- CTS Corporation (1)
- CUI Devices (1)
- Ohmite (1)
- Material:
-
- Package Cooled:
-
- Attachment Method:
-
- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Material Finish:
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10 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
Ohmite | HEATSINK BLACK A... |
5,600 |
1,000
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, EXTRUS... |
1,440 |
1,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEAT SINK PIN FIN... |
270 |
1,000
In-stock
|
Get Quote | |||
CTS Corporation | HEAT SINK FORGED... |
300 |
1,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEAT SINK ELLIP F... |
270 |
1,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEAT SINK PIN FIN... |
270 |
1,000
In-stock
|
Get Quote | |||
Wakefield Thermal | HEAT SINK ELLIP F... |
270 |
1,000
In-stock
|
Get Quote | |||
TE Connectivity AMP Connectors | HS ASSY CLIP |
1 |
1,000
In-stock
|
Get Quote | |||
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 300X... |
1 |
11
In-stock
|
Get Quote | |||
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 1220... |
1 |
10
In-stock
|
Get Quote |