- Manufacturer：
-
- CTS Corporation (1)
- CUI Devices (1)
- Part Status：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
2 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEATSINK HALF BR... |
1 |
1,000
In-stock
|
Get Quote | ||
|
|
CTS Corporation | HEATSINK PWR DUA... |
1 |
2,706
In-stock
|
Get Quote |
