- Manufacturer：
-
- CTS Corporation (1)
- Ohmite (1)
- Material：
-
- Package Cooled：
-
- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Material Finish：
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4 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Ohmite | HEATSINK AND CLI... |
1 |
7,765
In-stock
|
Get Quote | ||
|
|
CTS Corporation | HEATSINK PWR W/PI... |
1 |
4,020
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CER TO-2... |
1 |
53
In-stock
|
Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
1 |
1,000
In-stock
|
Get Quote |
