- Part Status：
-
- Package Cooled：
-
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
-
5 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Ohmite | HEATSINK FOR TO-2... |
1 |
1,000
In-stock
|
Get Quote | ||
|
|
Ohmite | TO-263 SMD HEAT SIN... |
1 |
1,000
In-stock
|
Get Quote | ||
|
|
Ohmite | HEATSINK FOR TO-2... |
1 |
1,648
In-stock
|
Get Quote | ||
|
|
Ohmite | HEATSINK AND CLI... |
1 |
16,204
In-stock
|
Get Quote | ||
|
|
Ohmite | TO-263 HEAT SINK / P... |
1 |
71
In-stock
|
Get Quote |
