- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
-
3 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEATSINK TO-220 |
5,000 |
1,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK TO-221 |
5,000 |
1,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK |
6,000 |
1,000
In-stock
|
Get Quote |
