- Manufacturer：
-
- Aavid (6)
- CUI Devices (9)
- T-Global Technology (27)
- Material：
-
- Shape：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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49 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEATSINK TO-220 4.1W... |
8,000 |
1,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 3.6W... |
4,000 |
1,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 3.6W... |
10,000 |
1,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR TO92 |
25,000 |
1,000
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
5,000 |
1,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
5,000 |
1,000
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
1,500 |
1,000
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
1,500 |
1,000
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
1 |
1,000
In-stock
|
Get Quote | ||
|
|
TE Connectivity AMP Connectors | SALEABLE PACKAGE... |
275 |
1,000
In-stock
|
Get Quote | ||
|
|
Aavid | HEAT SINK |
1,000 |
1,000
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
1 |
1,000
In-stock
|
Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK ANOD AL... |
1 |
50,378
In-stock
|
Get Quote | ||
|
|
T-Global Technology | ALUMINIUM HEAT S... |
1 |
197
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 BL... |
1 |
352
In-stock
|
Get Quote | ||
|
|
NTE Electronics, Inc. | HEATSINK FOR PLA... |
1 |
79
In-stock
|
Get Quote | ||
|
|
T-Global Technology | ALUMINIUM HEAT S... |
1 |
64
In-stock
|
Get Quote | ||
|
|
T-Global Technology | ALUMINIUM HEAT S... |
1 |
57
In-stock
|
Get Quote | ||
|
|
T-Global Technology | ALUMINIUM HEAT S... |
1 |
146
In-stock
|
Get Quote | ||
|
|
T-Global Technology | ALUMINIUM HEAT S... |
1 |
35
In-stock
|
Get Quote |
