- Manufacturer：
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- CUI Devices (1)
- Part Status：
-
- Type：
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- Package Cooled：
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- Attachment Method：
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- Thermal Resistance @ Natural：
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9 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEATSINK 21X21MM S... |
100 |
1,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK HALF BR... |
1 |
1,000
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 40MM X 40... |
1 |
2,582
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 32.5 X 32.5... |
1 |
159
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 40MM X 40... |
1 |
32
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK 21X21MM D... |
1 |
1,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK 21X21MM F... |
1 |
97
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 40X40X14.5M... |
10 |
1,000
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 32.5X32.5X1... |
10 |
1,000
In-stock
|
Get Quote |
