- Manufacturer：
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- CTS Corporation (1)
- Ohmite (1)
- Material：
-
- Package Cooled：
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- Attachment Method：
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- Thermal Resistance @ Forced Air Flow：
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2 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Ohmite | ALUMINUM HEATSIN... |
100 |
1,000
In-stock
|
Get Quote | ||
|
|
CTS Corporation | HEATSINK CPU W/AD... |
1 |
1,961
In-stock
|
Get Quote |
