- Type：
-
- Package Cooled：
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- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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58 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Aavid | HEAT SINK |
5,000 |
1,000
In-stock
|
Get Quote | ||
|
|
Aavid | 78015 EXTRUSION 2.3" |
3,000 |
1,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR .063" ... |
500 |
1,000
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
1,000 |
1,000
In-stock
|
Get Quote | ||
|
|
TE Connectivity AMP Connectors | GANGED QSFP LAN E... |
750 |
1,000
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
1,000 |
1,000
In-stock
|
Get Quote | ||
|
|
TE Connectivity AMP Connectors | GANGED QSFP SAN E... |
1,680 |
1,000
In-stock
|
Get Quote | ||
|
|
TE Connectivity AMP Connectors | QSFP SINGLE PCI E... |
1,000 |
1,000
In-stock
|
Get Quote | ||
|
|
Aavid | 78030 EXTRUSION 2.36X... |
10 |
1,000
In-stock
|
Get Quote | ||
|
|
TE Connectivity AMP Connectors | QSFP DOUBLE SAN H... |
1,320 |
1,000
In-stock
|
Get Quote | ||
|
|
TE Connectivity AMP Connectors | QSFP SINGLE SAN E... |
1 |
1,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR .063" ... |
500 |
1,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR .063" ... |
500 |
1,000
In-stock
|
Get Quote | ||
|
|
TE Connectivity AMP Connectors | HEAT SINK SFP DWD... |
2 |
372
In-stock
|
Get Quote | ||
|
|
Ohmite | DUAL PIN FIN HEAT... |
1 |
518
In-stock
|
Get Quote | ||
|
|
Ohmite | PIN FIN HEATSINK |
1 |
78
In-stock
|
Get Quote | ||
|
|
Aavid | 78025 EXTRUSION 1.24X... |
1 |
9
In-stock
|
Get Quote | ||
|
|
T-Global Technology | ALUMINIUM HEAT S... |
1 |
64
In-stock
|
Get Quote | ||
|
|
T-Global Technology | ALUMINIUM HEAT S... |
1 |
57
In-stock
|
Get Quote | ||
|
|
T-Global Technology | ALUMINIUM HEAT S... |
1 |
146
In-stock
|
Get Quote |
