- Manufacturer:
-
- CUI Devices (11)
- Attachment Method:
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Forced Air Flow:
-
- Thermal Resistance @ Natural:
-
12 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
CUI Devices | HEAT SINK, STAMPI... |
5,000 |
1,000
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, STAMPI... |
6,750 |
1,000
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, STAMPI... |
1 |
2,949
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, STAMPI... |
1 |
2,919
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, STAMPI... |
1 |
2,336
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, STAMPI... |
1 |
5,013
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, STAMPI... |
1 |
2,424
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, STAMPI... |
1 |
2,297
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, STAMPI... |
1 |
1,745
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, STAMPI... |
1 |
1,991
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, STAMPI... |
1 |
1,405
In-stock
|
Get Quote | |||
NTE Electronics, Inc. | HEAT SINK FOR TO2... |
1 |
342
In-stock
|
Get Quote |