- Manufacturer:
-
- CUI Devices (3)
- Package Cooled:
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
-
- Material Finish:
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13 Records
Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
---|---|---|---|---|---|---|---|
Wakefield Thermal | HEATSINK FOR TO92 |
25,000 |
1,000
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, STAMPI... |
5,000 |
1,000
In-stock
|
Get Quote | |||
T-Global Technology | CERAMIC HEAT SPR... |
1 |
53
In-stock
|
Get Quote | |||
T-Global Technology | CERAMIC HEAT SPR... |
1 |
72
In-stock
|
Get Quote | |||
T-Global Technology | CERAMIC HEAT SPR... |
1 |
35
In-stock
|
Get Quote | |||
T-Global Technology | CERAMIC HEAT SPR... |
1 |
100
In-stock
|
Get Quote | |||
T-Global Technology | CERAMIC HEAT SPR... |
1 |
14
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, STAMPI... |
1 |
1,970
In-stock
|
Get Quote | |||
CUI Devices | HEAT SINK, STAMPI... |
1 |
2,424
In-stock
|
Get Quote | |||
T-Global Technology | CERAMIC HEAT SPR... |
1 |
50
In-stock
|
Get Quote | |||
T-Global Technology | CERAMIC HEAT SPR... |
1 |
88
In-stock
|
Get Quote | |||
T-Global Technology | CERAMIC HEAT SPR... |
1 |
73
In-stock
|
Get Quote | |||
T-Global Technology | CERAMIC HEAT SPR... |
1 |
90
In-stock
|
Get Quote |