TDP:
Embedded Options Available:
Max+V5:BU6 Memory Size (dependent on memory type):
ECC Memory Supported ‡:
PCI Express Revision:
PCI Express Configurations ‡:
Max # of PCI Express Lanes:
Sockets Supported:
TJUNCTION:
Intel® AES New Instructions:
Intel® Trusted Execution Technology ‡:
Intel® Virtualization Technology for Directed I O (VT-d) ‡:
Image Part Manufacturer Description MOQ Stock Action
B915C AV8062701147401 SR0NZ Intel
Original Product
1
RFQ
5,000
In-stock
Get Quote
i3-2377M AV8062701048004 SR0CW Intel
Original Product
1
RFQ
5,000
In-stock
Get Quote
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