Bus Speed:
TDP:
Embedded Options Available:
Max+V5:BU6 Memory Size (dependent on memory type):
Max Memory Bandwidth:
Graphics Base Frequency:
# of Displays Supported ‡:
PCI Express Revision:
PCI Express Configurations ‡:
Sockets Supported:
Thermal Monitoring Technologies:
Lithography:
Intel® AES New Instructions:
Image Part Manufacturer Description MOQ Stock Action
i3-6100TE CM8066201938603 SR2LS Intel
Original Product
1
RFQ
5,000
In-stock
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i3-560 CM80616003177AH BX80616I3560 BXC80616I3560 Intel
Original Product
1
RFQ
5,000
In-stock
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i3-550 CM80616003174AJ BX80616I3550 BXC80616I3550 BX80526F550256 BX80526F550256E BX80525U550512 Intel
Original Product
1
RFQ
5,000
In-stock
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i3-530 CM80616003180AG BX80616I3530 BXC80616I3530 Intel
Original Product
1
RFQ
5,000
In-stock
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i3-540 Intel
Original Product
1
RFQ
5,000
In-stock
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