Launch Date:
Bus Speed:
TDP:
Embedded Options Available:
Max+V5:BU6 Memory Size (dependent on memory type):
Max Memory Bandwidth:
Graphics Max Dynamic Frequency:
Graphics Video Max Memory:
Max Resolution (DP)‡:
Max Resolution (eDP - Integrated Flat Panel)‡:
Max Resolution (VGA)‡:
DirectX* Support:
OpenGL* Support:
Device ID:
PCI Express Revision:
Sockets Supported:
Lithography:
Intel® InTru 3D Technology:
Intel® Virtualization Technology for Directed I O (VT-d) ‡:
Image Part Manufacturer Description MOQ Stock Action
i3-6100 CM8066201927202 BX80662I36100 BXC80662I36100 Intel
Original Product
1
RFQ
5,000
In-stock
Get Quote
i3-4170 CM8064601483645 BX80646I34170 BXC80646I34170 Intel
Original Product
1
RFQ
5,000
In-stock
Get Quote
1 / 1 Page, 2 Records