Launch Date:
Bus Speed:
TDP:
Embedded Options Available:
Max+V5:BU6 Memory Size (dependent on memory type):
Max Memory Bandwidth:
Graphics Max Dynamic Frequency:
Graphics Video Max Memory:
Max Resolution (HDMI)‡:
Max Resolution (DP)‡:
Max Resolution (eDP - Integrated Flat Panel)‡:
Max Resolution (VGA)‡:
DirectX* Support:
OpenGL* Support:
PCI Express Revision:
Sockets Supported:
Lithography:
Intel® InTru 3D Technology:
Intel® AES New Instructions:
Intel® Virtualization Technology for Directed I O (VT-d) ‡:
Image Part Manufacturer Description MOQ Stock Action
G3900 CM8066201928610 BX80662G3900 SR2HV Intel
Original Product
1
RFQ
5,000
In-stock
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G1840 Intel
Original Product
1
RFQ
5,000
In-stock
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