Configurable TDP-down:
Max Memory Bandwidth:
Max Resolution (DP)‡:
DirectX* Support:
OpenGL* Support:
PCI Express Revision:
PCI Express Configurations ‡:
Max # of PCI Express Lanes:
Sockets Supported:
TJUNCTION:
Processor Base Frequency:
Intel® InTru 3D Technology:
Intel® Transactional Synchronization Extensions:
Intel vPro® Platform Eligibility ‡:
Intel® Trusted Execution Technology ‡:
Intel® Stable IT Platform Program (SIPP):
Image Part Manufacturer Description MOQ Stock Action
M5-6Y57 HE8066201922876 SR2EG Intel
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1
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5,000
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M5-6Y54 HE8066201930524 SR2EM Intel
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1
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5,000
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M3-7Y32 HE8067702739830 SR346 Intel
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1
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5,000
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M3-7Y30 HE8067702739824 SR347 SR2ZY Intel
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1
RFQ
5,000
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5Y51 FH8065802061802 SR23L Intel
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1
RFQ
5,000
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5Y71 FH8065802061602 SR23Q Intel
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1
RFQ
5,000
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