Launch Date:
TDP:
Max Memory Bandwidth:
Max Resolution (DP)‡:
DirectX* Support:
OpenGL* Support:
PCI Express Revision:
PCI Express Configurations ‡:
Max # of PCI Express Lanes:
Sockets Supported:
TJUNCTION:
Intel® InTru 3D Technology:
Intel® Transactional Synchronization Extensions:
Intel vPro® Platform Eligibility ‡:
Intel® Trusted Execution Technology ‡:
Intel® Stable IT Platform Program (SIPP):
Image Part Manufacturer Description MOQ Stock Action
M5-6Y57 HE8066201922876 SR2EG Intel
Original Product
1
RFQ
5,000
In-stock
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M5-6Y54 HE8066201930524 SR2EM Intel
Original Product
1
RFQ
5,000
In-stock
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6500Y Intel
Original Product
1
RFQ
5,000
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5Y51 FH8065802061802 SR23L Intel
Original Product
1
RFQ
5,000
In-stock
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