Configurable TDP-down:
Max+V5:BU6 Memory Size (dependent on memory type):
Max Resolution (eDP - Integrated Flat Panel)‡:
DirectX* Support:
OpenGL* Support:
PCI Express Revision:
PCI Express Configurations ‡:
Max # of PCI Express Lanes:
Sockets Supported:
TJUNCTION:
Lithography:
Intel® InTru 3D Technology:
Intel® Transactional Synchronization Extensions:
Intel vPro® Platform Eligibility ‡:
Intel® Trusted Execution Technology ‡:
Intel® Stable IT Platform Program (SIPP):
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