TS991SNL35T4

Manufacturer :

Chip Quik, Inc.

Product Category :

Solder

Composition :

Sn96.5Ag3Cu0.5 (96.5/3/0.5)

Diameter :

-

Flux Type :

No-Clean

Form :

Syringe, 1.23 oz (34.869g)

Melting Point :

423°F (217°C)

Mesh Type :

4

Part Status :

Active

Process :

-

Shelf Life :

12 Months

Shelf Life Start :

Date of Manufacture

Storage/Refrigeration Temperature :

37°F ~ 77°F (3°C ~ 25°C)

Type :

Solder Paste

Wire Gauge :

-