28-6337-6470

Mfr.Part #
28-6337-6470
Manufacturer
Kester
Package/Case
-
Datasheet
Download
Description
SOLDER FLUX-CORED/331 63/37 .093
Manufacturer :
Kester
Product Category :
Solder
Composition :
Sn63Pb37 (63/37)
Flux Type :
Water Soluble
Form :
Spool, 20 lbs (9.07kg)
Melting Point :
361°F (183°C)
Mesh Type :
-
Part Status :
Active
Process :
Leaded
Shelf Life :
-
Shelf Life Start :
-
Storage/Refrigeration Temperature :
50°F ~ 104°F (10°C ~ 40°C)
Type :
Wire Solder
Wire Gauge :
11 AWG, 13 SWG
Datasheets
28-6337-6470

Manufacturer related products

Catalog related products

  • Chip Quik, Inc.
    THERMALLY STABLE SOLDER PASTE NO
  • Kester
    SOLDER FLUX-CORED/285 .031" 1LB
  • Chip Quik, Inc.
    SOLDER PASTE SN63/PB37 250G T5
  • Henkel/Loctite
    97SC C511 2% .064DIA 14AWG
  • Henkel/Loctite
    97SC 400 2% .064DIA 14AWG

Related products

Part Manufacturer Stock Description
28-600-10 Aries Electronics, Inc. 6 CONN HDR DIP FORK 28POS TIN
28-600-11 Aries Electronics, Inc. 1,000 CONN HDR DIP FORK 28POS GOLD
28-600-20 Aries Electronics, Inc. 1,000 CONN HDR DIP POST 28POS TIN
28-600-21 Aries Electronics, Inc. 7 CONN HDR DIP POST 28POS GOLD
28-6040-0053 Kester 1,000 SOLDER FLUX-CORED/44 .050 20LB S
28-6040-0061 Kester 1,000 SOLDER FLUX-CORED/44 .062" 20LB
28-650-10 Aries Electronics, Inc. 88 DIP HEADER COVER 28 PIN .270
28-650000-10 Aries Electronics, Inc. 156 SOCKET ADAPTER SOIC TO 28DIP 0.6
28-650000-11-RC Aries Electronics, Inc. 192 SOCKET ADAPTER SOIC TO 28DIP 0.6
28-650000-11-RC-P Aries Electronics, Inc. 1,000 SOCKET ADAPTER SOIC TO 28DIP 0.6
28-6501-20 Aries Electronics, Inc. 1,000 CONN IC DIP SOCKET 28POS TIN
28-6501-21 Aries Electronics, Inc. 1,000 CONN IC DIP SOCKET 28POS GOLD
28-6501-30 Aries Electronics, Inc. 1,000 CONN IC DIP SOCKET 28POS TIN
28-6501-31 Aries Electronics, Inc. 1,000 CONN IC DIP SOCKET 28POS GOLD
28-6503-20 Aries Electronics, Inc. 1,000 CONN IC DIP SOCKET 28POS GOLD