HSB15-404010

Mfr.Part #
HSB15-404010
Manufacturer
CUI Devices
Package/Case
-
Datasheet
Download
Description
HEAT SINK, BGA, 40 X 40 X 10 MM
Manufacturer :
CUI Devices
Product Category :
Thermal - Heat Sinks
Attachment Method :
Adhesive
Diameter :
-
Material :
Aluminum Alloy
Material Finish :
Black Anodized
Package Cooled :
BGA
Part Status :
Active
Power Dissipation @ Temperature Rise :
6.3W @ 75°C
Shape :
Square, Pin Fins
Thermal Resistance @ Forced Air Flow :
3.90°C/W @ 200 LFM
Thermal Resistance @ Natural :
11.84°C/W
Type :
Top Mount
Datasheets
HSB15-404010

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