303N

Manufacturer :

Wakefield Thermal

Product Category :

Thermal - Heat Sinks

Attachment Method :

Press Fit

Diameter :

-

Material :

Aluminum Alloy

Material Finish :

Black Anodized

Package Cooled :

Stud Mounted Semiconductor Cases

Part Status :

Active

Power Dissipation @ Temperature Rise :

15.0W @ 37°C

Shape :

Rectangular, Fins

Thermal Resistance @ Forced Air Flow :

1.30°C/W @ 250 LFM

Thermal Resistance @ Natural :

-

Type :

Board Level, Vertical