HS33

Mfr.Part #
HS33
Manufacturer
Apex Microtechnology
Package/Case
-
Datasheet
Download
Description
HEATSINK FOR DK AND HQ PACKAGES
Manufacturer :
Apex Microtechnology
Product Category :
Thermal - Heat Sinks
Attachment Method :
Bolt On
Diameter :
-
Material :
Aluminum
Material Finish :
-
Package Cooled :
-
Part Status :
Discontinued at Digi-Key
Power Dissipation @ Temperature Rise :
-
Shape :
Rectangular, Fins
Thermal Resistance @ Forced Air Flow :
-
Thermal Resistance @ Natural :
16.00°C/W
Type :
Board Level
Datasheets
HS33

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