HSB20-353525
- Mfr.Part #
- HSB20-353525
- Manufacturer
- CUI Devices
- Package/Case
- -
- Datasheet
- Download
- Description
- HEAT SINK, BGA, 35 X 35 X 25 MM
- Manufacturer :
- CUI Devices
- Product Category :
- Thermal - Heat Sinks
- Attachment Method :
- Adhesive
- Diameter :
- -
- Material :
- Aluminum Alloy
- Material Finish :
- Black Anodized
- Package Cooled :
- BGA
- Part Status :
- Active
- Power Dissipation @ Temperature Rise :
- 11.3W @ 75°C
- Shape :
- Square, Pin Fins
- Thermal Resistance @ Forced Air Flow :
- 2.70°C/W @ 200 LFM
- Thermal Resistance @ Natural :
- 6.65°C/W
- Type :
- Top Mount
- Datasheets
- HSB20-353525
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