TC3-3.5G
- Mfr.Part #
- TC3-3.5G
- Manufacturer
- Chip Quik, Inc.
- Package/Case
- -
- Datasheet
- Download
- Description
- HEAT SINK THERMAL COMPOUND
- Manufacturer :
- Chip Quik, Inc.
- Product Category :
- Thermal - Adhesives, Epoxies, Greases, Pastes
- Color :
- Gray
- Features :
- -
- Part Status :
- Active
- Shelf Life :
- 60 Months
- Size / Dimension :
- 3.5 gram Syringe
- Storage/Refrigeration Temperature :
- 37°F ~ 77°F (3°C ~ 25°C)
- Thermal Conductivity :
- 8.50W/m-K
- Type :
- Silicone Compound
- Usable Temperature Range :
- -40°F ~ 302°F (-40°C ~ 150°C)
- Datasheets
- TC3-3.5G
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