BDN09-3CB

Manufacturer :

CTS Corporation

Product Category :

Thermal - Heat Sinks

Attachment Method :

Thermal Tape, Adhesive (Not Included)

Diameter :

-

Material :

Aluminum

Material Finish :

Black Anodized

Package Cooled :

Assorted (BGA, LGA, CPU, ASIC...)

Part Status :

Active

Power Dissipation @ Temperature Rise :

-

Shape :

Square, Pin Fins

Thermal Resistance @ Forced Air Flow :

9.60°C/W @ 400 LFM

Thermal Resistance @ Natural :

26.90°C/W

Type :

Top Mount