HSS07-C20-P274

Mfr.Part #
HSS07-C20-P274
Manufacturer
CUI Devices
Package/Case
-
Datasheet
Download
Description
HEAT SINK, STAMPING, TO-220, 21.
Manufacturer :
CUI Devices
Product Category :
Thermal - Heat Sinks
Attachment Method :
PC Pin
Diameter :
-
Material :
Copper Alloy
Material Finish :
Tin
Package Cooled :
TO-220
Part Status :
Active
Power Dissipation @ Temperature Rise :
2.5W @ 75°C
Shape :
Rectangular
Thermal Resistance @ Forced Air Flow :
12.60°C/W @ 200 LFM
Thermal Resistance @ Natural :
29.57°C/W
Type :
Board Level, Vertical
Datasheets
HSS07-C20-P274

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